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Micron’s $100 billion semiconductor megafab project in Clay, NY, is set to break ground on Jan. 16, marking a significant milestone in the U.S. tech sector construction.
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The multi-phase development, spanning two decades, is planned to include up to four fabrication plants, with the potential to support tens of thousands of construction, supplier, and operational roles.
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The facility will focus on advanced memory chips for AI and data centers, aiming to strengthen the U.S. semiconductor supply chain with federal support.
Micron says its long-awaited semiconductor megafab project in New York state is set to break ground, marking one of the largest U.S. construction starts in the tech sector.
The company stated that it will be ready to begin ground preparation and construction on January 16 at its Onondaga County megafab site in the town of Clay, NY.
The announcement follows years of planning, including the completion of an environmental review and permit approvals, according to a Micron statement dated January 7, 2026.
Multi-Phase Development Over Two Decades
The megafab will be built in White Pine Commerce Park and is planned as a long-term, multi-phase development over approximately two decades, previously estimated by the company to be up to $100 billion.
Officials said the facility “will be home to the most advanced memory manufacturing in the world and will help meet the growing demands of the AI systems that are central to the modern economy.”
A partial rendering of the planned Micron megafab semiconductor manufacturing facility in Clay, NY. The campus is planned for up to four semiconductor fabrication plants. Image: Micron
Company leaders and federal, state, and local officials are scheduled to mark the groundbreaking with a ceremony in Clay, followed by a program at Syracuse University’s National Veterans Resource Center.
Project Scope of Megafab Campus
The campus is planned for up to four semiconductor fabrication plants, also known as fabs, which Micron said would make it the largest semiconductor facility in the United States upon completion. Each of the four fabs will span 27.5 acres or 1.2 million square feet, including 600,000 square feet of cleanroom space and an equal area for supporting infrastructure.
The plan was announced in 2022 to support the U.S. goal of expanding domestic memory chip manufacturing and reclaiming global leadership in semiconductor production.
The project is expected to support tens of thousands of direct and indirect jobs over the life of the build, including construction, supplier, and operational roles, according to prior state and company estimates.
Advanced Memory Chip Production
The facility will focus on advanced memory products used in data centers, AI workloads, and other compute-intensive applications, positioning the campus as a key domestic component in the global semiconductor supply chain.
The company has framed the Clay site as central to its long-term U.S. manufacturing strategy, supported by federal incentives aimed at expanding domestic chip production.
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